Business
Semiconductor-related Materials
We offer a comprehensive range of high-quality materials manufactured in Japan for semiconductor manufacturing processes.
In addition, through close collaboration with our group company, Electronics End Materials Corporation, we are able to supply a wide variety of wafer products to meet diverse customer needs.
Key Products and Services
Front-end Process
- Various silicon wafers (Prime wafers, Test wafers, Reclaimed wafers, etc.)
- Materials and equipment for CMP (Chemical Mechanical Planarization) processes (slurries, chemical supply systems, etc.)
Back-end Process
- Plating chemicals
- Encapsulation materials, DAM materials, and lead frame materials
- High-performance materials (thermal management materials, adhesion enhancement materials, etc.)
