Business

Semiconductor Packaging Materials

We are handling various kind of packaging materials which are widely used in IC assembly process. We are proud to introduce our Japan-Made materials, with its leading edge quality, it can always gives our customers the best solution. We are also offering the excellent after-sales service with high customer satisfaction.
 
    Main Products    
  • IC Substrate
  • Molding compound
  • Interlayer Insulating film
  • Various Adhesive
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